
Thick Film Screen Printing of Conductors (Ag, AgPt, AgPd, Au etc.), Dielectrics, Resistors (from 10 mohm to 1 Gohm), Glass Encapsulants, Polymeric Resins
Thick Film Multilayers, Ag based, Au based etc.
Resistor Laser Trimming, high…

SMT assembly on Ceramics, PCBs, Flex Prints and other kind of substrates.
SMD components from 0201, BGA, µBGA, QFN, Flip Chip etc.
Go to the customization form

Die Attach and Wire Bonding processes.
Several kind of Die Attach resins (with high thermal conductivity, for biomedical devices, etc.)
Wedge and Ball bonding, from 15 µm to 75 µm diameter Al and Au wires
Go…

Encapsulation: Epoxy, Silicone, UV curable Glob Tops, etc.
Go to the customization form

Die Attach, Wire Bonding and Encapsulation on Polymide Flex Circuit
Go to the customization form

Multilayer Thick Film Hybrid Circuit with SMD components and Chip&Wire technology.
Go to the customization form

Double sided Screen Printed ceramic substrate, Die Attach of a MEMS, Die Attach of a glass component on the die, Wire bonding and Encaspulation
Go to the customization form