Thick Film Screen Printing of Conductors (Ag, AgPt, AgPd, Au etc.), Dielectrics, Resistors (from 10 mohm to 1 Gohm), Glass Encapsulants, Polymeric Resins
Thick Film Multilayers, Ag based, Au based etc.
Resistor Laser Trimming, high…
SMT assembly on Ceramics, PCBs, Flex Prints and other kind of substrates.
SMD components from 0201, BGA, µBGA, QFN, Flip Chip etc.
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Die Attach and Wire Bonding processes.
Several kind of Die Attach resins (with high thermal conductivity, for biomedical devices, etc.)
Wedge and Ball bonding, from 15 µm to 75 µm diameter Al and Au wires
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Encapsulation: Epoxy, Silicone, UV curable Glob Tops, etc.
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Die Attach, Wire Bonding and Encapsulation on Polymide Flex Circuit
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Multilayer Thick Film Hybrid Circuit with SMD components and Chip&Wire technology.
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Double sided Screen Printed ceramic substrate, Die Attach of a MEMS, Die Attach of a glass component on the die, Wire bonding and Encaspulation
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