Metallux's Mendrisio site is specialized in the production of complex substrates in thick film technology and in the assembly of microelectronics on ceramics or PCBs. High quality electronics has been produced for decades, serving the automotive, industrial, and medical industries. The site's range of services include development, support, technological product design, prototype construction, series production, and qualification procedures.

Quality assurance stations for functional tests in series production are developed and set up from in-house engineering. Our approach ensures that even the most stringent quality requirements are met. The production site has 1,300 m² of clean rooms up to ISO class 7 (class 10000). Various encapsulation processes up to hermetic enclosures complete the capabilities of the production site.

Our highly skilled and motivated engineering team uses the best and brightest thinking to develope production processes for customers in the field of the medical and industrial technologies. Our superior-quality manufacturing process is certified according to ISO9001, ISO13485 and IATF 16949. We aim to deliver high-quality, competitive, consistent products focusing on research and development.

Metallux approach every client's unique project with an open toolbox and an open mind from the idea to the finished product. The first step of our approach is to analyze the application requirements and to define the target-cost with focus on design and performance.

Through advanced manufacturing and several testing methods, we are able to guarantee the production of high-quality reliable and durable Swiss made products. Component traceability turns quality assurance into quality insurance. Through advanced manufacturing and several testing methods, we are able to guarantee the production of high-quality reliable and durable Swiss made products. Component traceability turns quality assurance into quality insurance.

Metallux's electronic production services include the following production processes:

Assembly
- Laser marking / labelling of printed circuit boards with unique serial numbers
- Online tracking of production steps, component batches, and test data at assembly level
- Solder paste screen printing
- 2D solder paste inspection
- SMD assembly of printed circuit boards
- Reflow soldering
- Manual soldering according to IPC A-610
- Programming of integrated circuits
- Fully automatic coating and encapsulation of assemblies
- Assembly of prototypes, small series up to high-volume production

Inspection and Testing
- Automatic optical inspection (AOI)
- Functional testing
- Run-in/burn-in testing
- Cable testing
- X-ray inspection
- Assembly
- Checks and tests

SMT Assembly of very small components from 01005 (0.2mm x 0.4mm) to large BGAs of 40mm x 40mm with Chip & Wire technology.

Die Bonding
Metallux uses both bonding and soldering technologies for the assembly of bare chips in ISO 8 clean production. DNA- and RNA-free manufacturing is granted in ISO 7 clean rooms.

Wire Bonding
Metallux masters all bonding methods; wedge-wedge with Aluminium or Gold wire, wedge-wedge ribbon bonding with Aluminium or Gold ribbon, ball-stitch or ball-stitch on stud bump. The diameter of the wires used varies from 12.5µm to 50µm.

Encapsulation
A wide range of glob top materials is available, from epoxy to silicone or acrylic resins. Flip chips or micro BGA chips environmental protection is granted with underfill resins.

Screening, testing and qualification.
To ensure consistent quality and reliability, Metallux offers extensive testing and screening processes. Our consistency and processes are certified according to ISO 9001, ISO 13485 normatives.