Combined Technologies: Double sided Thick Film Circuit, Glass on Chip and Chip&Wire | metallux.ch

HIGHLIGHTS

METALLUX AT COMPAMED 2019

From 18 to 21 November 2019, Metallux will exhibit at…

METALLUX AT SENSOR + TEST 2019

Metallux welcomes you at our stand at the SENSOR+TEST in…

FIVE TOP-CLASS QUALITY CERTIFICATIONS FOR METALLUX

We at Metallux are proud to announce that, after the…

Double sided Screen Printed ceramic substrate, Die Attach of a MEMS, Die Attach of a glass component on the die, Wire bonding and Encaspulation

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