Chip on Board (COB)
Die Attach and Wire Bonding processes.
Several kind of Die Attach resins (with high thermal conductivity, for biomedical devices, etc.)
Wedge and Ball bonding, from 15 µm to 75 µm diameter Al and Au wires
Die Attach and Wire Bonding processes.
Several kind of Die Attach resins (with high thermal conductivity, for biomedical devices, etc.)
Wedge and Ball bonding, from 15 µm to 75 µm diameter Al and Au wires