Hybrid Circuits

THICK FILM TECHNOLOGY CIRCUITS – SMT AND COB ASSEMBLY SERVICES

 

Metallux SA focus is thick-film technology, integrated with screen-printing, trimming and soldering processes, as well as “chip & wire” technology.

Based on customers’ design and specifications, we design and produce thick-film electronic circuits for the broadest scope of applications.

 

 

Our capability:

– Clean room production environment (three clean rooms)

– Design and development of optimized circuit layouts

– Screen printing on ceramic, FR4, Flex, steel, aluminum nitride, sapphire

– Assemblies of electronic modules on ceramic or other special substrates

– Multilayer hybrid circuits with integrated resistors

– Active and passive Surface Mounted Technology (SMT), from 0201 to BGA and μBGA

– Chip-and-wire: MEMS or silicon die attach + wedge bonding or ball bonding

– Flip-chip: soldering and epoxy anisotropic attach

– Hot bar attach soldering process

– Laser trimming

– Finishing and encapsulation with conformal coatings, epoxy and silicone resins

– Integrated pull and advanced shear tests

 

Go to the customization form